20th Colloquium "Joint Research in Adhesive Technology"
From March 3rd to 4th, Hauschild & Co. KG will be present as a sponsor and exhibitor in Würzburg
From March 3rd to 4th, 2020, the 20th colloquium “Joint research in adhesive bonding technology” will take place in the Marienberg Fortress in Würzburg.
The colloquium "Joint research in adhesive technology" has been the forum for adhesive developers, manufacturers and users for many years and in 2020 it will be presented for the 20th time. The industry comes together to find out about the latest developments and innovations along the entire process chain and to specifically strengthen partnerships. And we are there too!
At our booth we will present our entire product portfolio as well as the brand new Hauschild SpeedMixer® DAC 150.3 and DAC 250.3. Take the opportunity to speak to our experts personally.
You can find more information about the colloquium here.